Method for forming through holes in a polyimide substrate

Details Method for forming through holes in a polyimide substrate Method for forming through holes in a polyimide substrate

1989-11-29

1990-09-25

Powell, William A.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156630, 156634, 156652, 156655, 156656, 1566591, 1566611, 156668, 156902, 156643, 156646, 21912169, 21912185, B44C 122, C23F 102, C03C 1500, B29C 3700

Patent

active

049591193

ABSTRACT:
Hole formation in a polyimide substrate employs a carbon dioxide laser.

REFERENCES:
patent: 4426253 (1984-01-01), Kreuz et al.
patent: 4472238 (1984-09-01), Johnson
patent: 4635358 (1987-01-01), Fritz
patent: 4642160 (1987-02-01), Burgess
patent: 4714516 (1987-12-01), Eichelberger et al.
patent: 4894115 (1990-01-01), Eichelberger et al.

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