Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1984-07-02
1985-06-18
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156646, 156652, 156655, 1566591, 156668, 156644, 204192E, 427 38, 427 88, 430317, B44C 122, C03C 1500, C03C 2506, B29C 1708
Patent
active
045239762
ABSTRACT:
A method is disclosed for forming openings in polyimide layers and for thereby forming semiconductor devices. The method allows for the forming of openings having tapered side walls and precise dimensional control. First and second layers of polyimide are sequentially formed on a surface. The first layer, in contact with the surface, is fully cured while the second layer is only partially cured. Overlying the second layer is a masking layer which can alternatively be an inorganic material or a resist material. A pattern is formed in the masking layer to expose portions of the upper polyimide layer. The pattern includes openings of predetermined size having a precise critical dimension. Using the patterned masking layer as an etch mask the upper layer of polyimide is isotropically etched in an etchent which etches the partially cured polyimide but which does not etch the fully cured underlying polyimide. The underlying polyimide layer is then anisotropically etched using the patterned masking layer as an etch mask to form openings in the cured polyimide layer having the same critical dimensions as in the masking layer pattern. The masking layer is then removed and the second polyimide layer is fully cured.
REFERENCES:
patent: 4372034 (1983-02-01), Bohr
patent: 4487652 (1984-12-01), Almgren
Fisher John A.
Motorola Inc.
Powell William A.
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