Fishing – trapping – and vermin destroying
Patent
1989-06-23
1991-10-22
Hearn, Brian E.
Fishing, trapping, and vermin destroying
437200, 148DIG19, 148DIG147, H01L 21283
Patent
active
050595547
ABSTRACT:
A method for fabricating integrated circuits is used to improve contacts between polycrystalline interconnect and underlying polycrystalline or monocrystalline silicon regions. After contact openings are formed, a layer of titanium is deposited over the integrated circuit. The titanium is reacted in nitrogen to form a silicide layer only in the openings. Titanium nitride and unreacted titanium are then removed, and a layer of polycrystalline silicon deposited and patterned. The silicide layer between the polycrystalline interconnect and the underlying silicon ensures that a high quality contact is formed.
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Chen Fusen F.
Liou Fu-Tai
Spinner Charles R.
Hearn Brian E.
Hill Kenneth C.
Quach T. N.
Robinson Richard K.
SGS-Thomson Microelectronics Inc.
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