Method for forming poly-silicon film

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

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Details

C438S488000, C438S511000, C257SE31047, C257SE21316

Reexamination Certificate

active

07923357

ABSTRACT:
A poly-silicon film formation method for forming a poly-silicon film doped with phosphorous or boron includes heating a target substrate placed in a vacuum atmosphere inside a reaction container, and supplying into the reaction container a silicon film formation gas, a doping gas for doping a film with phosphorous or boron, and a grain size adjusting gas containing a component to retard columnar crystal formation from a poly-silicon crystal and to promote miniaturization of the poly-silicon crystal, thereby depositing a silicon film doped with phosphorous or boron on the target substrate.

REFERENCES:
patent: 4642414 (1987-02-01), Rasch et al.
patent: 5894037 (1999-04-01), Kikuchi et al.
patent: 2005/0260862 (2005-11-01), Komatsu et al.
patent: 2006/0051911 (2006-03-01), Gu et al.
patent: 7-86173 (1995-03-01), None
patent: 9-129562 (1997-05-01), None

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