Method for forming planar metal/insulator structures

Details Method for forming planar metal/insulator structures Method for forming planar metal/insulator structures

1981-12-21

1983-08-02

Kimlin, Edward C.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156646, 156652, 156653, 156656, 156664, 156665, 156667, 427 86, 427 89, 427 90, 4271263, 427307, 427404, 427405, 4274192, 430314, 430316, 430318, 430323, 430324, H01L 21306, B44C 122, C03C 1500, C03C 2506

Patent

active

043964583

ABSTRACT:
Formation of planar conductor/insulator semiconductor devices utilizing hafnium coated aluminum based metallization with a magnesium oxide mask for dry etching of the metallization and deposition of planar insulation.
The hafnium coating is used to protect the aluminum metallization during mask removal, and as a registration enhancer for subsequent electron-beam processing.

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