Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1991-06-06
1993-05-11
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156643, 156644, 156645, 156652, 1566591, 1566611, 156668, H01L 2100
Patent
active
052098150
ABSTRACT:
A method of forming patterned film onto a substrate includes the steps of: depositing a polyether sulfone release layer 50; depositing a photoresist underlayer 52; patterning a predetermined film pattern through the underlayer 52 and the polyether sulfone layer 50; depositing a film layer 60 onto the wafer, thereby forming a patterned film 62 on the substrate 10; weakening the mechanical bonding strength to the polyether sulfone release layer 50 by immersing it in NMP; stripping off layers 54 and 60 by applying an adhesive backed tape 64 to the top of the film layer and applying a pulling force; and, removing the polyether sulfone release layer 50 by immersing the wafer in a NMP bath.
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IBM Technical Disclosure Bulletin, vol. 19 No. 4, Sep. 1976, "Stripping Promotor for Lift-off Mask", by P. Carr et al.
Fleming Robert J.
Lawson Margaret J.
Leonard Edward J.
Rhoads Bryan N.
Balconi-Lamica Michael J.
Dang Thi
International Business Machines - Corporation
Romanchik Richard A.
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