Method for forming multi-layer bumps on a substrate

Details Method for forming multi-layer bumps on a substrate Method for forming multi-layer bumps on a substrate

2008-09-09

2008-09-09

Le, Thao X. (Department: 2892)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C257SE21508

Reexamination Certificate

active

11341302

ABSTRACT:
A method for forming multi-layer bumps on a substrate includes depositing an adhesive or a flux on the substrate, depositing a first metal powder on the adhesive, and melting or reflowing the adhesive and first metal powder to form first bumps. An adhesive or a flux and a second metal powder are then deposited on the first bumps, and melted to form second bumps on the first bumps to form multi-layer bumps. The multi-layer bumps are formed without the need for any wet chemicals.

REFERENCES:
patent: 5470787 (1995-11-01), Greer
patent: 5880017 (1999-03-01), Schwiebert et al.
patent: 2002/0064930 (2002-05-01), Ishikawa
patent: 2005/0141150 (2005-06-01), Bentley et al.
patent: 0 899 786 (1999-09-01), None
patent: 07153764 (1995-06-01), None
patent: 2002 076043 (2002-03-01), None

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