Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2006-03-07
2006-03-07
Barreca, Nicole (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S198000, C430S313000, C430S330000, C430S945000
Reexamination Certificate
active
07008754
ABSTRACT:
By using a novel method, the exposure time of the photosensitive paste layer is reduced and the exposure fineness of the layer is improved, thereby developing a highly fine circuit substrate of high density having a thermal resistance at a reasonable cost. A circuit substrate is manufactured as follows. A photosensitive paste containing photoresist and a circuit material is applied onto a substrate surface so as to form a photosensitive paste layer (4). This photosensitive paste layer (4) is plotted by a laser beam (8) so as to form a plotted area (7). The photosensitive paste layer (4) is developed and an exposed area (4a) or an unexposed area (4b) is removed so as to form a circuit pattern (17). This circuit pattern (17) is sintered to form a circuit pattern (20) composed of the circuit material. It is possible to form a highly fine circuit pattern of high density by laser beam plotting. Moreover, when a greensheet (2) is used as the substrate, it is possible to form a ceramic substrate (18) having a thermal resistance by sintering. Furthermore, by using this method, it is possible to form an arbitrary image on an arbitrary object.
REFERENCES:
patent: 4887225 (1989-12-01), Yao
patent: 5676781 (1997-10-01), Aoki et al.
patent: 6156237 (2000-12-01), Kubota et al.
patent: 0 814 382 (1997-12-01), None
patent: 59-114856 (1984-07-01), None
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English abstract of JP 59-114856 from JPO “Formation of Thick FIlm CIrcuit Pattern”, Hisako et al., Jul. 1984.
PTO: 2005-2982, English translation of JP 59-114856, “Method for Formation of Thick Film Circuit Pattern”, Hisako et al., Jul. 1984.
Harada Akio
Kato Masatoshi
Barreca Nicole
Daiken Chemical Co., Ltd.
Koda & Androlia
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