Method for forming fine pattern of semiconductor device

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

Reexamination Certificate

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C430S316000

Reexamination Certificate

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07989145

ABSTRACT:
A method for forming a fine pattern of a semiconductor device comprises forming a spin-on-carbon layer over an underlying layer, forming an anti-reflection pattern including a silicon containing polymer with a first etching mask pattern, forming a photoresist pattern including a silicon containing polymer with a second etching mask pattern between elements of the first etching mask pattern, and etching the spin-on-carbon layer with the etching mask patterns to reduce the process steps and the manufacturing cost, thereby obtaining a uniform pattern profile.

REFERENCES:
patent: 5750680 (1998-05-01), Kim et al.
patent: 6051678 (2000-04-01), Kim et al.
patent: 6132926 (2000-10-01), Jung et al.
patent: 6143463 (2000-11-01), Jung et al.
patent: 6150069 (2000-11-01), Jung et al.
patent: 6180316 (2001-01-01), Kajita et al.
patent: 6225020 (2001-05-01), Jung et al.
patent: 6235447 (2001-05-01), Lee et al.
patent: 6235448 (2001-05-01), Lee et al.
patent: 6541077 (2003-04-01), Kozawa et al.
patent: 6720256 (2004-04-01), Wu et al.
patent: 7144968 (2006-12-01), Kozawa et al.
patent: 7223525 (2007-05-01), Lipinski
patent: 7655568 (2010-02-01), Lee et al.
patent: 7807336 (2010-10-01), Lee et al.
patent: 2006/0003268 (2006-01-01), Hong et al.
patent: 2007/0148983 (2007-06-01), Lee et al.
patent: 10-2005-0002384 (2005-01-01), None
patent: 10-2005-0027133 (2005-03-01), None
patent: 10-0618907 (2006-08-01), None
patent: 10-2007-0070035 (2007-07-01), None
patent: 10-2007-0093177 (2007-09-01), None
English-language translation of Chinese Office Action for Application No. 200810000431.2, issued Sep. 25, 2009.

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