Method for forming electrically conductive layers on chip carrie

Details Method for forming electrically conductive layers on chip carrie Method for forming electrically conductive layers on chip carrie

1996-12-30

1999-11-16

Baxter, Janet

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430313, 430318, 427 97, 438667, 216 18, G03F 700

Patent

active

059855215

ABSTRACT:
A method for fabricating a chip carrier, such as a printed circuit board, which includes at least one through hole or via hole, is disclosed. In accordance with this method, an electrically conductive layer is formed on at least one of the major surfaces of the corresponding chip carrier substrate, as well as for the surface of the through hole or via hole. Significantly, the electrically conductive layer on the at least one major surface is relatively thin, which permits the formation of a relatively high density of circuit lines in this layer. On the other hand, the electrically conductive layer on the surface of the through hole or via hole is relatively thick, which prevents the formation of defects in this layer.

REFERENCES:
patent: 4211603 (1980-07-01), Reed
patent: 4642160 (1987-02-01), Burgess
patent: 4770900 (1988-09-01), Seibel
patent: 4983252 (1991-01-01), Masui et al.
patent: 5236810 (1993-08-01), Kondo et al.
patent: 5427895 (1995-06-01), Magnuson et al.
patent: 5504992 (1996-04-01), Fukutomi et al.

Affiliated with

Also associated with

Rating

Method for forming electrically conductive layers on chip carrie does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming electrically conductive layers on chip carrie, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming electrically conductive layers on chip carrie will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1322562