Method for forming electrically conductive circuits on a base bo

Details Method for forming electrically conductive circuits on a base bo Method for forming electrically conductive circuits on a base bo

1986-08-12

1988-03-29

Schor, Kenneth M.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156666, 156630, 156637, 156656, 156901, 156902, 427 98, 29846, 428901, H01L 21306

Patent

active

047341564

ABSTRACT:
A method for forming electrically conductive circuits on a base board is described, the method comprising the steps of: forming a first electrically conductive circuit layer on one side of a base board, the first circuit layer being receptive to a metal plating; coating a plating-resistant resist on the same side of the base board excluding certain portions of the first circuit layer which are required to be electrically connected to another circuit layer to be subsequently formed on the first circuit layer; coating an electrically conductive copper paste being receptive to a metal plating on the same side of the base board in a manner as to electrically connect said portions of the first circuit layer, with the exception of certain regions of said portions of the first circuit layer which are to be subsequently processed with a metal plating; heating the base board to harden the same; cleansing the base board; and immersing the base board in a metal plating solution to form a metal plating on the electrically conductive copper paste and on said regions of said portions of the first circuit layer, to thereby form a second electrically conductive circuit layer on the first circuit layer.

REFERENCES:
patent: 4076575 (1978-02-01), Chang
patent: 4353816 (1982-10-01), Iwasa
patent: 4420364 (1983-12-01), Nukii et al.
patent: 4525383 (1985-06-01), Saito
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 4639285 (1987-01-01), Suzuki et al.
patent: 4661372 (1987-04-01), Mance

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