Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate
2005-08-16
2005-08-16
Zarabian, Amir (Department: 2822)
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
C438S624000, C438S660000, C438S672000
Reexamination Certificate
active
06930043
ABSTRACT:
Disclosed is a method for forming bit line and bit line contact structure. Based on a semi-finished structure with a poly plug filled in a contact window, the method of the Invention comprises steps of removing some of the oxide layer so that the plug protrudes, oxidizing the exposed region of the protruding portion of the plug, removing the oxidized portion of the plug, forming a first dielectric layer to the upper surface of the resultant structure, wherein the upper surface of the plug is exposed, forming a second dielectric layer to the upper surface of the first dielectric layer including the upper surface of the plug, forming photoresist on the second dielectric layer, then performing exposing, developing and etching to form a trench of a predetermined pattern, and filling metal into the trench to form a bit line.
REFERENCES:
patent: 5795823 (1998-08-01), Avanzino et al.
patent: 6696355 (2004-02-01), Dennison
Kuan Shih-Fan
Wu Kuo-Chien
Bacon & Thomas PLLC
Nanya Technology Corp.
Novacek Christy
Zarabian Amir
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