Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1986-12-22
1989-01-17
Niebling, John F.
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419225, 20419226, C23C 1438
Patent
active
047986603
ABSTRACT:
A method for fabricating a copper indium diselenide semiconductor film comprising use of DC magnetron sputtering apparatus to sequentially deposit a first film of copper on a substrate and a second film of indium on the copper film. Thereafter the substrate with copper and indium films is heated in the presence of gas containing selenium at a temperature selected to cause interdiffusion of the elements and formation of a high quality copper indium diselenide film. In a preferred form, an insulating substrate is used and an electrical contact is first deposited thereon in the same DC magnetron sputtering apparatus prior to deposition of the copper and indium films.
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patent: 4581108 (1986-04-01), Kapur et al.
T. L. Chu et al., Large Grain Copper Indium Diselenide Films, J. Electrochem. Soc.: Solid State Science and Technology, Sep. 1984, pp. 2182-2185.
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S. P. Grindle et al., Preparation and Properties of CuInS.sub.2 Thin Films . . . , Appl. Phys. Lett., 35(1), Jul. 1, 1979, pp. 24-26.
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Chemical Vapor Deposited Copper Indium Diselenide Thin Film Materials Research, Poly Solar Inc., Garland, Tex., Mar. 1984, SERI/STR-211-2247.
Ermer James H.
Love Robert B.
Atlantic Richfield Company
Leader William T.
Metrailer Albert C.
Niebling John F.
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