Method for forming Cu In Se.sub.2 films

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering

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20419225, 20419226, C23C 1438

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active

047986603

ABSTRACT:
A method for fabricating a copper indium diselenide semiconductor film comprising use of DC magnetron sputtering apparatus to sequentially deposit a first film of copper on a substrate and a second film of indium on the copper film. Thereafter the substrate with copper and indium films is heated in the presence of gas containing selenium at a temperature selected to cause interdiffusion of the elements and formation of a high quality copper indium diselenide film. In a preferred form, an insulating substrate is used and an electrical contact is first deposited thereon in the same DC magnetron sputtering apparatus prior to deposition of the copper and indium films.

REFERENCES:
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patent: 4581108 (1986-04-01), Kapur et al.
T. L. Chu et al., Large Grain Copper Indium Diselenide Films, J. Electrochem. Soc.: Solid State Science and Technology, Sep. 1984, pp. 2182-2185.
J. L. Vossen et al., Thin Film Processes, Academic Press, New York, 1978, pp. 167-170.
S. P. Grindle et al., Preparation and Properties of CuInS.sub.2 Thin Films . . . , Appl. Phys. Lett., 35(1), Jul. 1, 1979, pp. 24-26.
J. Piekoszewski et al., RF-Sputtered CuInSe.sub.2 Thin Films, Solar Energy Materials, 2(1980), pp. 363-372.
M. S. Tomar et al., A ZnO/p-CuInSe.sub.2 Thin Film Solar Cell . . . , Thin Solid Films, 90(1982), pp. 419-423.
Chemical Vapor Deposited Copper Indium Diselenide Thin Film Materials Research, Poly Solar Inc., Garland, Tex., Mar. 1984, SERI/STR-211-2247.

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