Method for forming barrier metal layer of bit line in...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S309000, C257S070000

Reexamination Certificate

active

07994558

ABSTRACT:
A semiconductor memory device includes a titanium layer and a titanium nitride layer formed on a substrate, a thin layer formed on the titanium nitride layer, and a metal layer formed on the thin layer, wherein the thin layer increases a grain size of the metal layer.

REFERENCES:
patent: 5969983 (1999-10-01), Thakur et al.
patent: 6156630 (2000-12-01), Iyer
patent: 6287964 (2001-09-01), Cho
patent: 6545357 (2003-04-01), Chopra
patent: 6753618 (2004-06-01), Basceri et al.
patent: 2003/0042133 (2003-03-01), Lee et al.
patent: 2003/0199137 (2003-10-01), Lee et al.
patent: 2005/0110058 (2005-05-01), Hu
patent: 1998-055960 (1998-09-01), None
patent: 1998-055960 (1998-10-01), None
patent: 10-2003-0049591 (2003-06-01), None
patent: 2003-0049591 (2003-10-01), None
Machine translation of Korean patent 2003-0049591 is attached.
Machine translation of Korea patent 1998-055960 is attached.
Notice of Preliminary Rejection from the Korean Intellectual Property Office, mailed Jul. 16, 2007 in Korean Patent Application No. 2005-0079535 and English translation thereof.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming barrier metal layer of bit line in... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming barrier metal layer of bit line in..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming barrier metal layer of bit line in... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2715543

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.