Method for forming anti-stiction bumps on a micro-electro...

Details Method for forming anti-stiction bumps on a micro-electro... Method for forming anti-stiction bumps on a micro-electro...

2007-12-04

2007-12-04

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C257SE21016

Reexamination Certificate

active

11105152

ABSTRACT:
A technique for forming anti-stiction bumps on a bottom surface of a micro-electro mechanical (MEM) structure includes a number of process steps. The MEM structure is fabricated from an assembly that includes a support substrate bonded to a single-crystal semiconductor layer, via an insulator layer. A plurality of holes are formed through the single-crystal semiconductor layer to the insulator layer on an interior portion of a defined movable structure. A portion of the insulator layer underneath the holes is removed. The holes are then filled with a conformal film that extends below a lower surface of the defined movable structure to provide a plurality of anti-stiction bumps. A trench is then formed through the single-crystal semiconductor layer to the insulator layer to form the defined movable structure. Finally, a remainder of the insulator layer underneath the defined movable structure is removed to free the defined movable structure.

REFERENCES:
patent: 6930366 (2005-08-01), Kiihamaki

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