Method for forming an electrical connection

Details Method for forming an electrical connection Method for forming an electrical connection

2011-03-22

2011-03-22

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S832000, C136S256000, C136S258000

Reexamination Certificate

active

07908743

ABSTRACT:
Embodiments of the present invention provide a method of forming an electrical connection on a device. In one embodiment, the electrical connection is attached to the device via an adhesive having electrically conductive particles disposed therein. In one embodiment, the adhesive is cured while applying pressure such that the conductive particles align, have a reduced particle-to-particle spacing, or come into contact with each other to provide a more directly conductive (less resistive) path between the electrical connection and the device. In one embodiment of the present invention, a method for forming an electrical lead on a partially formed solar cell during formation of the solar cell device is provided. The method comprises placing a side-buss wire onto a pattern of electrically conductive adhesive disposed on a back contact layer of a solar cell device substrate, laminating the side-buss wire and electrically conductive adhesive between the solar cell device substrate and a back glass substrate to form a composite solar cell structure, and curing the electrically conductive adhesive while applying pressure and heat to the composite solar cell structure.

REFERENCES:
patent: 4532372 (1985-07-01), Nath et al.
patent: 4590327 (1986-05-01), Nath et al.
patent: 4633034 (1986-12-01), Nath et al.
patent: 4773944 (1988-09-01), Nath et al.
patent: 5084107 (1992-01-01), Deguchi et al.
patent: 5181968 (1993-01-01), Nath et al.
patent: 6077722 (2000-06-01), Jansen et al.
patent: 6107920 (2000-08-01), Eberhardt et al.
patent: 6256549 (2001-07-01), Romero et al.
patent: 6265242 (2001-07-01), Komori et al.
patent: 6288325 (2001-09-01), Jansen et al.
patent: 6384727 (2002-05-01), Diprizio et al.
patent: 6423565 (2002-07-01), Barth et al.
patent: 6455347 (2002-09-01), Hiraishi et al.
patent: 6784361 (2004-08-01), Carlson et al.
patent: 6841728 (2005-01-01), Jones et al.
patent: 7294298 (2007-11-01), Iijima
patent: 7432438 (2008-10-01), Rubin et al.
patent: 7732243 (2010-06-01), Luch
patent: 2003/0044539 (2003-03-01), Oswald
patent: 2003/0127128 (2003-07-01), Fabick et al.
patent: 2003/0129810 (2003-07-01), Barth et al.
patent: 2005/0072455 (2005-04-01), Gerhardinger et al.
patent: 2005/0241692 (2005-11-01), Rubin et al.
patent: 2005/0252545 (2005-11-01), Nowlan et al.
patent: 2006/0068134 (2006-03-01), Iijima
patent: 2007/0056626 (2007-03-01), Funcell
patent: 2009/0038675 (2009-02-01), Tsunomura et al.
patent: 2009/0077805 (2009-03-01), Bachrach et al.
patent: 2001-180822 (2001-07-01), None
patent: 2004-153137 (2004-05-01), None
patent: 2004-335680 (2004-11-01), None
patent: 2005-235916 (2005-09-01), None
patent: 2006-088511 (2006-04-01), None
patent: 2009/029901 (2009-03-01), None
patent: 2009/029902 (2009-03-01), None
Detlev Koch-Ospelt. “End-to-End Mass Production Solutions for Gen 1 & 2 Silicon Thin Film Modules”. Power Point. Jun. 13, 2007.
International Search Report and Written Opinion dated Sep. 30, 2010 for PCT International Application No. PCT/US2009/035579.
International Search Report and Written Opinion dated Nov. 10, 2010 for International Application No. PCT/US2010/030114.

Affiliated with

Also associated with

Rating

Method for forming an electrical connection does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming an electrical connection, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming an electrical connection will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2665457