Method for forming an array substrate including forming a...

Details Method for forming an array substrate including forming a... Method for forming an array substrate including forming a...

2007-05-07

2009-06-16

Brewster, William M. (Department: 2823)

Semiconductor device manufacturing: process

Making field effect device having pair of active regions...

On insulating substrate or layer

C438S708000, C438S951000

Reexamination Certificate

active

07547590

ABSTRACT:
Disclosed is a method for manufacturing an array substrate utilizing a laser ablation process. With the laser ablation process, a photoresist layer is removed along with the transparent conductive layer therefrom, while maintaining other portions of the transparent conductive layer. Moreover, the laser ablation process of the invention does not need additional photo-mask, so the fabrication cost can be reduced.

REFERENCES:
patent: 6356320 (2002-03-01), Chung et al.
patent: 6593978 (2003-07-01), Vu et al.
patent: 6700631 (2004-03-01), Inoue et al.
patent: 6885389 (2005-04-01), Inoue et al.
patent: 6913957 (2005-07-01), Yang
patent: 7060541 (2006-06-01), Lee et al.
patent: 7206057 (2007-04-01), Yoo et al.
patent: 2005/0242365 (2005-11-01), Yoo
patent: 2005/0247950 (2005-11-01), Nakamura et al.
patent: 2006/0003553 (2006-01-01), Park et al.
patent: 2007/0081107 (2007-04-01), Huitema et al.
patent: 2007/0170435 (2007-07-01), Yoo et al.
patent: 588462 (2004-05-01), None
patent: 589745 (2004-06-01), None
patent: 220534 (2004-08-01), None
patent: 254911 (2006-05-01), None
TW Search Report mailed May 28, 2008.

Affiliated with

Also associated with

Rating

Method for forming an array substrate including forming a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming an array substrate including forming a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming an array substrate including forming a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4071798