Method for forming align key pattern in semiconductor device

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437924, H01L 21762

Patent

active

055785190

ABSTRACT:
A method for forming an align key pattern in a semiconductor device is provided. The method has the steps of forming a first insulating film pattern for defining field regions in a cell array area and an align key pattern area on a semiconductor substrate, forming trenches in the field regions, using the first insulating film pattern as a mask, forming a second insulating film on the whole surface of the semiconductor substrate, filling the trenches, etching the second insulating film formed on the active regions of the cell array area and on the active and field regions of the align key pattern area, to a predetermined thickness, etching back the whole surface of the semiconductor substrate, forming a conductive layer on the whole surface of the semiconductor substrate, and covering a photoresist on the whole surface of the conductive layer. According to the present invention, an align key pattern needed for a photolithography process is obtainable by forming steps in an align key pattern area in a semiconductor device having an STI structure.

REFERENCES:
patent: 5310691 (1994-05-01), Suda
patent: 5316966 (1994-05-01), Van Der Plas et al.
patent: 5385861 (1995-01-01), Bashir et al.
patent: 5470782 (1995-11-01), Schwalke et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming align key pattern in semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming align key pattern in semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming align key pattern in semiconductor device will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1972641

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.