Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device
Reexamination Certificate
2006-02-14
2006-02-14
McPherson, John A. (Department: 1756)
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making electrical device
C430S311000, C430S316000, C216S051000, C216S067000, C216S063000
Reexamination Certificate
active
06998221
ABSTRACT:
The present invention provides a method for forming a via (e.g., a trench, via or contact) in a substrate. The method, in one embodiment of the invention, includes patterning an opening220in a photoresist layer210located over an intermediate layer located over a substrate. In that particular embodiment the opening220has a predetermined width230. The method may further include etching into the intermediate layer120such that an intermediate opening310is formed, the intermediate opening310having a decreasing width that terminates at a targeted width320less than the predetermined width230. Additionally, the method may include continuing the etching within the intermediate opening310and at least partially into the substrate110to form a via opening510in the substrate. In this particular embodiment, the width520of the via opening510is substantially equal to the targeted width320.
REFERENCES:
patent: 6524875 (2003-02-01), Figura et al.
Brady III W. James
Chacko-Davis Daborah
McLarty Peter K.
McPherson John A.
Telecky , Jr. Frederick J.
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