Coating apparatus – Gas or vapor deposition – With treating means
Patent
1997-01-10
2000-01-04
Breneman, R. Bruce
Coating apparatus
Gas or vapor deposition
With treating means
118723R, 156345, C23C 1600
Patent
active
060098287
ABSTRACT:
A method for producing a thin semiconductor film according to the present invention includes the steps of: placing a group-IV compound or a derivative thereof in a plasma state; decomposing the group-IV compound or the derivative thereof into active species; and depositing the active species on a substrate, wherein energy for generating plasma is intermittently supplied at a supply time interval which is equal to or less than a reciprocal of {(secondary reaction rate constant of a source gas reacting with active species other than long-life active species within the plasma).times.(number of source gas molecules)}.
REFERENCES:
patent: 4808258 (1989-02-01), Otsubo et al.
patent: 4863549 (1989-09-01), Grunwald
patent: 5057185 (1991-10-01), Thomas, III et al.
patent: 5093703 (1992-03-01), Minami et al.
patent: 5160397 (1992-11-01), Doki et al.
patent: 5324388 (1994-06-01), Yamano et al.
patent: 5405448 (1995-04-01), Jost et al.
patent: 5455061 (1995-10-01), Matossian et al.
patent: 5468341 (1995-11-01), Samukawa
patent: 5487786 (1996-01-01), Chida et al.
T. Yoshida et al, "Film Deposition Process in Pulse Discharge CVD", Amorphous Silicon Technology, MRS Symposium Proceedings, vol. 219, Apr. 30, 1991 --May 3 1991, pp. 655-665 (XP-002077932).
Appl. Phys. Lett., vol. 53, No. 14, pp. 1263-1265, 1988, "Effects of low-frequency modulation on rf discharge chemical vapor depositon".
Appl. Phys. Lett., vol.57, No. 16, pp. 1616-1618, 1990, "Powder-free plasma chemical vapor deposition of hydrogenated amorphous silicon with high rf power density using modulated rf discharge".
Applied Physics, vol. 62, No. 7, pp. 699-702, 1993, "Formation of powder in rf silane plasmas and its growth suppression".
Nomoto Katsuhiko
Sannomiya Hitoshi
Takagi Sae
Tomita Takashi
Yamamoto Yoshihiro
Alejandro Luz
Breneman R. Bruce
Sharp Kabushiki Kaisha
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