Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making named article
Patent
1996-12-20
1999-06-22
Nuzzolillo, Maria
Radiation imagery chemistry: process, composition, or product th
Imaging affecting physical property of radiation sensitive...
Making named article
156160, 156163, G03G 500
Patent
active
059142189
ABSTRACT:
A photolithographically patterned spring contact is formed on a substrate and electrically connects contact pads on two devices. The spring contact also compensates for thermal and mechanical variations and other environmental factors. An inherent stress gradient in the spring contact causes a free portion of the spring contact to bend up and away from the substrate. An anchor portion remains fixed to the substrate and is electrically connected to a first contact pad on the substrate. The spring contact is made of an elastic material and the free portion compliantly contacts a second contact pad, thereby electrically interconnecting the two contact pads.
REFERENCES:
patent: 2562685 (1951-07-01), Adams
patent: 3356369 (1967-12-01), Stubbmann
patent: 4320438 (1982-03-01), Ibrahim et al.
patent: 4423401 (1983-12-01), Mueller
patent: 4758927 (1988-07-01), Berg
patent: 5121298 (1992-06-01), Sarma et al.
patent: 5152695 (1992-10-01), Grabbe et al.
patent: 5280139 (1994-01-01), Suppelsa et al.
patent: 5487999 (1996-01-01), Farnworth
patent: 5513430 (1996-05-01), Yanof et al.
patent: 5665648 (1997-09-01), Little
A.E. "Bill" Corwith, "Probing at Die Level", Advanced Packaging, Jan./Feb. 1995, pp. 26 & 28 IBM Technical Disclosure vol. 34 No. 7B, Dec. 1991.
Alimonda Andrew Sebastian
Smith Donald Leonard
Nuzzolillo Maria
Weiner Laura
Xerox Corporation
LandOfFree
Method for forming a spring contact does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for forming a spring contact, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a spring contact will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1707619