Method for forming a single crystal silicon layer

Details Method for forming a single crystal silicon layer Method for forming a single crystal silicon layer

1983-08-25

1986-03-25

Bernstein, Hiram H.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

C30B 108

Patent

active

045781435

ABSTRACT:
Disclosed herein is a process for forming a single crystal silicon layer by heating a wafer, which is made of a single crystal silicon substrate and a starting silicon layer made of amorphous or polycrystalline silicon and provided on the silicon substrate, in accordance with the epitaxial growth technique. The process comprises providing a heat source which is formed of a plurality of tubular lamps provided side by side with their longitudinal axes extending substantially in parallel with one another in a second plane lying above and substantially in parallel with a first plane--in which the wafer is placed--and a tubular melting-lamp provided at a position between the first and second planes and with its longitudinal axis substantially in parallel with the longitudinal axes of the tubular lamps in the second plane; and moving the wafer in the first plane and in a direction perpendicular to the longitudinal axes of the plurality of tubular lamps and that of the tubular melting-lamp in a state that all the tubular lamps of the heat source, including the tubular melting-lamp, are lit on. The above process can convert the starting silicon layer in its entirety into a single crystal silicon layer in a relatively short period of time and without danger of damaging the wafer. The above process facilitates formation of single crystal silicon layers which make up SOI structures.

REFERENCES:
patent: 2933384 (1960-04-01), Welker et al.
patent: 3630684 (1971-12-01), Keller
patent: 4081313 (1978-03-01), McNeilly et al.

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