Method for forming a semiconductor

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S487000

Reexamination Certificate

active

07368367

ABSTRACT:
A preparing method of a semiconductor, particularly a preparing method of a polycrystal semiconductor film which has a good electrical property is disclosed. In order to obtain a non-crystalline silicon film containing a lot of combination of hydrogen and silicon, a forming process of a non-crystalline silicon film by a low temperature gas phase chemical reaction, a process of a heat annealing to produce a lot of dangling bonds of silicon, so as to draw out hydrogen from said non-crystalline silicon film, and a process of applying a laser irradiation to said non-crystal silicon film having a lot of dangling bond of silicon are conducted.

REFERENCES:
patent: 4059461 (1977-11-01), Fan et al.
patent: 4151058 (1979-04-01), Kaplan et al.
patent: 4226898 (1980-10-01), Ovshinsky et al.
patent: 4229502 (1980-10-01), Wu et al.
patent: 4266986 (1981-05-01), Benton et al.
patent: 4309225 (1982-01-01), Fan et al.
patent: 4313783 (1982-02-01), Davies et al.
patent: 4321420 (1982-03-01), Kaplan et al.
patent: 4322253 (1982-03-01), Pankove et al.
patent: 4370175 (1983-01-01), Levatter
patent: 4379727 (1983-04-01), Hansen et al.
patent: 4388145 (1983-06-01), Hawkins et al.
patent: 4402762 (1983-09-01), John et al.
patent: 4405435 (1983-09-01), Tateishi et al.
patent: 4406709 (1983-09-01), Celler et al.
patent: 4436557 (1984-03-01), Wood et al.
patent: 4475027 (1984-10-01), Pressley
patent: 4482395 (1984-11-01), Hiramoto
patent: 4498416 (1985-02-01), Bouchaib
patent: 4503807 (1985-03-01), Nakayama et al.
patent: 4523370 (1985-06-01), Sullivan et al.
patent: 4552595 (1985-11-01), Hoga
patent: 4555301 (1985-11-01), Gibson et al.
patent: 4557036 (1985-12-01), Kyuragi et al.
patent: 4567061 (1986-01-01), Hayashi et al.
patent: 4569697 (1986-02-01), Tsu et al.
patent: 4571348 (1986-02-01), Troxell
patent: 4576851 (1986-03-01), Iwamatsu
patent: 4582720 (1986-04-01), Yamazaki
patent: 4589951 (1986-05-01), Kawamura
patent: 4590091 (1986-05-01), Rogers et al.
patent: 4592306 (1986-06-01), Gallego
patent: 4592799 (1986-06-01), Hayafuji
patent: 4595601 (1986-06-01), Horioka et al.
patent: 4609407 (1986-09-01), Masao et al.
patent: 4638110 (1987-01-01), Erbert
patent: 4640223 (1987-02-01), Dozier
patent: 4663829 (1987-05-01), Hartman et al.
patent: 4694143 (1987-09-01), Nishimura et al.
patent: 4698486 (1987-10-01), Sheets
patent: 4699863 (1987-10-01), Sawatari et al.
patent: 4719123 (1988-01-01), Haku et al.
patent: 4785962 (1988-11-01), Toshima
patent: 4800174 (1989-01-01), Ishihara et al.
patent: 4808554 (1989-02-01), Yamazaki
patent: 4843022 (1989-06-01), Yamazaki
patent: 4888305 (1989-12-01), Yamazaki et al.
patent: 4937205 (1990-06-01), Nakayama et al.
patent: 4951601 (1990-08-01), Maydan et al.
patent: 4988642 (1991-01-01), Yamazaki
patent: 5091334 (1992-02-01), Yamazaki et al.
patent: 5132754 (1992-07-01), Serikawa et al.
patent: 5145808 (1992-09-01), Sameshima et al.
patent: 5149675 (1992-09-01), Wills et al.
patent: 5171710 (1992-12-01), Yamazaki et al.
patent: 5174881 (1992-12-01), Iwasaki et al.
patent: 5186718 (1993-02-01), Tepman et al.
patent: 5194398 (1993-03-01), Miyachi et al.
patent: 5198371 (1993-03-01), Li
patent: 5200017 (1993-04-01), Kawasaki et al.
patent: 5219786 (1993-06-01), Noguchi
patent: 5234528 (1993-08-01), Nishi
patent: 5266116 (1993-11-01), Fujioka et al.
patent: 5288658 (1994-02-01), Ishihara
patent: 5292675 (1994-03-01), Codama
patent: 5296405 (1994-03-01), Yamazaki et al.
patent: 5304357 (1994-04-01), Sato et al.
patent: 5306651 (1994-04-01), Masumo et al.
patent: 5310410 (1994-05-01), Begin et al.
patent: 5314538 (1994-05-01), Maeda et al.
patent: 5314839 (1994-05-01), Mizutani et al.
patent: 5318919 (1994-06-01), Noguchi et al.
patent: 5324360 (1994-06-01), Kozuka
patent: 5352291 (1994-10-01), Zhang et al.
patent: 5372836 (1994-12-01), Imahashi et al.
patent: 5578520 (1996-11-01), Zhang et al.
patent: 5708252 (1998-01-01), Shinohara et al.
patent: 5861337 (1999-01-01), Zhang et al.
patent: 6174374 (2001-01-01), Zhang et al.
patent: 6494162 (2002-12-01), Zhang et al.
patent: 6576534 (2003-06-01), Zhang et al.
patent: 6770143 (2004-08-01), Zhang et al.
patent: 0211634 (1987-02-01), None
patent: 57-180116 (1982-11-01), None
patent: 60-42817 (1985-03-01), None
patent: 60-105216 (1985-06-01), None
patent: 60-227484 (1985-11-01), None
patent: 62-104117 (1987-05-01), None
patent: 63-160336 (1988-07-01), None
patent: 63-224318 (1988-09-01), None
patent: 64-72522 (1989-03-01), None
patent: 1-179410 (1989-07-01), None
patent: 1-251734 (1989-10-01), None
patent: 2-12812 (1990-01-01), None
patent: 2-73623 (1990-03-01), None
patent: 2-081424 (1990-03-01), None
patent: 02-81424 (1990-03-01), None
patent: 02-103924 (1990-04-01), None
patent: 2-103924 (1990-04-01), None
patent: 02-239615 (1990-09-01), None
patent: 2-239615 (1990-09-01), None
patent: 2-257619 (1990-10-01), None
patent: 2-295111 (1990-12-01), None
patent: 03-19370 (1991-01-01), None
patent: 03-22540 (1991-01-01), None
patent: 3-22540 (1991-01-01), None
patent: 03-24717 (1991-02-01), None
patent: 3-24717 (1991-02-01), None
patent: 3-201430 (1991-09-01), None
patent: 3-286518 (1991-12-01), None
patent: 4-179267 (1992-06-01), None
patent: 63-224318 (1998-09-01), None
“High Mobility Poly-Si Thin Film Transistors Using Solid Phase Crystallized A-Si Films Deposited by Plasma-Enhanced Chemical Vapor Deposition” Satoshi Takenaka et al., Japanese Journal of Applied Physics, vol. 29, No. 11, Dec. 1990.
“Vapor Phase Growth,” G.B. Stringfellow;Crystal Growth, vol. 16, 2ndEd., Pamplin, Chapter 5, pp. 181-202; unknown date.
Kuwano et al., (1981), 15thIEEE Photovoltaic Spec. Conf., pp. 698-703.
October 1989,Nikkei Microdevices(magazine) pp. 34-39.
Sameshima et al., (1989)Jpn. J. Appl. Phys., vol. 28, No. 10, (pp. 1789-1793).
Sera et al., (1989)IEEE Trans. On Elect. Devices, vol. 36, No. 12 (pp. 2868-2872).
Jhon et al., (1994)Jpn. J. Appl. Phys., vol. 33, pp. L 1438-L 1441.
Wagner et al., (1989)Appl. Surf. Science, 43, pp. 260-263.
Takenaka et al., (1990)Jpn. J. Appl. Phys., vol. 29, No. 12, pp. L 2380-2383.
“Vapor Phase Growth,” G.B. Stringfellow;Crystal Growth, vol. 16, 2ndEd., Pamplin, Chapter 5, pp. 181-202, 1980.
Jhon et al., (1994)Jpn. J. Appl. Phys., vol. 33, pp. L 1438-L 1441, Part 2, No. 10B.
Sameshima et al., “XeCI Excimer Laser Annealing Used in the Fabrication of Poly-Si TFT's,” IEEE Electron Device Letters, vol. 7, No. 5, May 1986, pp. 276-278.
Sera et al, “High-Performance TFT's Fabricated by XeCI Excimer Laser Annealing of Hydrogenated Amorphous-Silicon Film,” IEEE Transactions on Electron Devices, vol. 36, No. 12, Dec. 1989, pp. 2868-2872.
Wolf, et al., “Silicon Processing for the VLSI Era, vol. 1: Process Technology,” Lattice Press, vol. 1, 1986, pp. 161-175, 335.
Madan, et al, “Use of PECVD Systems in Thin Film Technology,” Workshop on Industrial Plasma Applications, Sep. 1989, pp. 1-10.
Pinarbasi, et al., “Effect of Hydrogen on the Microstructural, Optical and Electronic Properties of a-Si:H Thin Films Deposited by Direct Current Magnetron Reactive Sputtering,” Journal of Vacuum Science & Technology A: Vacuum, Surfaces, and Films, vol. 7, No. 3, May 1989, pp. 1210-1214.
Kakkad et al., “Crystallized Si Films by Low-Temperature Rapid Thermal Annealing of Amorphous Silicon,” J. Appl. Phys., vol. 65, No. 5, Mar. 1, 1989, pp. 2069-2072.
Lucovsky et al., “Formation of Silicon-Based Heterostructures in Multichamber Integrated-Processing Thin-Film Deposition Systems,” Multichamber and In-Situ Processing of Electronic Materials, SPIE, vol. 1188, 1989, pp. 140-150.
Zhang et al., “KrF Excimer Laser Annealed TFT with Very High Field-Effect Mobility of 329 cm2/V-s,” IEEE Electron Device Letters, vol. 13, No. 5, May 1992, pp. 297-299.
Pinarbasi, et al., “Effect of Hydrogen on the Microstructural, Optical and Electronic Properites of a-Si:H Thin Films Deposited by Direct Current Magnetron Reactive Sputtering,” Journal of Vacuum Science & Technology, 2ndS

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming a semiconductor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming a semiconductor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a semiconductor will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3983140

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.