Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of...
Reexamination Certificate
2007-04-03
2007-04-03
Lindsay, Jr., Walter (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
C438S760000, C427S240000, C257SE21259
Reexamination Certificate
active
11098181
ABSTRACT:
A preferred embodiment of the invention provides a method of spin coating a liquid, such as a resist, onto a surface of a substrate. An embodiment of the invention comprises dispensing a liquid onto the surface; spinning the substrate at a first rotational velocity at least until the liquid forms a substantially uniform film on the surface of the substrate; and spinning the substrate at a second rotational velocity in an opposite direction at least until the liquid reforms a substantially uniform film on the surface of the substrate. Other embodiments include a first rotational acceleration for accelerating the substrate to the first rotational velocity, and a second rotational acceleration for accelerating the substrate to the second rotational velocity. Preferably, the second rotational acceleration is much larger than the first rotational acceleration. Still other embodiments include repeating the first velocity, second velocity sequence one or more times.
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Infineon - Technologies AG
Lee Kyoung
Lindsay, Jr. Walter
Slater & Matsil L.L.P.
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