Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-11-14
2000-01-25
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438592, 438660, 438952, H01L 213213, H01L 21324, H01L 21441
Patent
active
060178191
ABSTRACT:
A polysilicon/amorphous silicon composite layer for improved linewidth control in the patterning of gate electrodes, in the manufacture of metal oxide semiconductor (MOS) devices. The formation of a composite polysilicon/amorphous silicon gate in an integrated circuit gives the device the electrical performance and doping qualities of a polysilicon gate and also gives the device the smoothness of an amorphous silicon gate which improves line definition during gate patterning.
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Brigham Lawrence N.
Jan Chia-Hong
Zhang Binglong
Intel Corporation
Nguyen Ha Tran
Niebling John F.
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