Method for forming a patterned layer on a substrate

Details Method for forming a patterned layer on a substrate Method for forming a patterned layer on a substrate

1992-07-23

1994-08-02

Bowers, Jr., Charles L.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430314, 430318, 1566611, G03F 700

Patent

active

053344871

ABSTRACT:
The present invention provides a method of forming a pattern of conductive material on dielectric material with access openings or vias through said dielectric material and such a structure. A sheet of conductive material, which is to be circuitized, is provided with a layer of a first photoimageable dielectric material on one face thereof. A layer of a second photoimageable material, such as a conventional photoresist material, is provided on the opposite face of the conductive material. The layer of said first photoimageable material is selected such that it will not be developed by the developer that develops the layer of said second material. The two layers of photoimageable material are pattern-wise exposed to radiation. The second layer of material is developed and the revealed underlying conductive material is etched to form the desired circuit pattern. The first layer is then developed to form openings or vias communicating with the circuit pattern, and these are then filled with a conductive material such as solder.

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IBM Tech. Disc. Bulletin vol. 31, No. 6, Nov. 1988, "Solder Mask Protective Coating for Flexible Printed Circuits" p. 144.
IBM Technical Discl. Bulletin, vol. 15, No. 2, Jul. 1972 "Chip Interconnection Device", p. 420.

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