Method for forming a multi-layer planarization structure

Etching a substrate: processes – Forming or treating electrical conductor article

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427574, 427583, 427509, 427 99, 427579, 438699, 438763, H01L 2120

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056292457

ABSTRACT:
An improved CVD apparatus for depositing a uniform film is shown. The apparatus comprises a reaction chamber, a substrate holder and a plurality of light sources for photo CVD or a pair of electrodes for plasma CVD. The substrate holder is a cylindrical cart which is encircled by the light sources, and which is rotated around its axis by a driving device. With this configuration, the substrates mounted on the cart and the surroundings can be energized by light of plasma evenly throughout the surfaces to be coated.

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