Method for forming a microwave field effect transistor with...

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having schottky gate

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C438S172000, C438S175000, C438S182000, C438S285000, C438S590000, C257S183000, C257S192000, C257S194000, C257S195000

Reexamination Certificate

active

06867078

ABSTRACT:
A microwave field effect transistor (10) has a high conductivity gate (44) overlying a double heterojunction structure (14, 18, 22) that has an undoped channel layer (18). The heterojunction structure overlies a substrate (12). A recess layer that is a not intentionally doped (NID) layer (24) overlies the heterojunction structure and is formed with a predetermined thickness that minimizes impact ionization effects at an interface of a drain contact of source/drain ohmic contacts (30) and permits significantly higher voltage operation than previous step gate transistors. Another recess layer (26) is used to define a gate dimension. A Schottky gate opening (42) is formed within a step gate opening (40) to create a step gate structure. A channel layer (18) material of InxGa1−xAs is used to provide a region of electron confinement with improved transport characteristics that result in higher frequency of operation, higher power density and improved power-added efficiency.

REFERENCES:
patent: 4551905 (1985-11-01), Chao et al.
patent: 5281839 (1994-01-01), Cambou et al.
patent: 5374835 (1994-12-01), Shimada et al.
patent: 5399886 (1995-03-01), Hasegawa
patent: 6479896 (2002-11-01), Tanabe
patent: 6483135 (2002-11-01), Mizuta et al.
patent: 6521961 (2003-02-01), Costa et al.
patent: 6627473 (2003-09-01), Oikawa et al.
Wakejima, Akio et al.; “A GaAs-Based Field-Modulating Plate HFET with Improved WCDMA Peak-Output-Power Characteristics”; IEEE Transactions on Electron Devices; Sep., 2003; pp 983-1987; vol. 50, No. 9; IEEE.
Okamoto, Yasuhiro et al.; “An 80W AlGaN/GaN Heterojunction FET with a Field-Modulating Plate”; IEEE MTT-S Digest, 2003; pp 225-228; IEEE.
Wakejima, Akio et al.; “Field-Modulating Plate (FP) InGaP MESFET with High Breakdown Voltage and Low Distortion”, IEEE Radio Frequency Integrated Circuit Symposium; 2001; pp 151-154; IEEE.
Sakura, N. et al.; “100W L-Band GaAs Power FP-HFET Operated at 30V”; IEEE MTT-S Digest; 2000; pp 1715-1718; IEEE.
Hara, Naoki et al.; “Low-Distrotion GaAs-Based Field Effect Transistors with InGaP Channel Layer for High-Voltage Operation”; IEDM; 1998; pp 3.4.1-3.4.4; IEEE.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming a microwave field effect transistor with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming a microwave field effect transistor with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a microwave field effect transistor with... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3389917

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.