Method for forming a metallurgical interconnection layer package

Details Method for forming a metallurgical interconnection layer package Method for forming a metallurgical interconnection layer package

1992-09-14

1994-03-08

McCamish, Marion E.

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

430311, 430314, 430318, 430329, 156 89, 156625, G03F 700, H05K 302

Patent

active

052926249

ABSTRACT:
A multilayer interconnection system is formed on a multilayer ceramic (MLC), or glass ceramic body, by screening a blanket layer of etchable conductive paste on the body, drying and firing the resistant paste layer, and delineating the circuit pattern in the blanket layer with lithographic and etching techniques. A dielectric layer with via openings is formed over the circuit pattern, and the via openings filled. The steps are repeated until the desired circuitry is fabricated. A top circuit pattern is formed by screening an etchable conductive paste on the top surface, drying and firing the paste, and delineating the pattern using photolithographic and etching techniques.

REFERENCES:
patent: 4373019 (1983-02-01), Watanabe
patent: 4430365 (1984-02-01), Schaible
patent: 4665468 (1987-05-01), Dohya
patent: 4806188 (1989-02-01), Rellick

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