Method for forming a high quality low temperature silicon...

Coating processes – Coating by vapor – gas – or smoke – Mixture of vapors or gases utilized

Reexamination Certificate

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C427S255394, C427S533000, C427S535000

Reexamination Certificate

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10327467

ABSTRACT:
A method of forming a silicon nitride film is described. According to the present invention, a silicon nitride film is deposited by thermally decomposing a silicon
itrogen containing source gas or a silicon containing source gas and a nitrogen containing source gas at low deposition temperatures (e.g., less than 550° C.) to form a silicon nitride film. The thermally deposited silicon nitride film is then treated with hydrogen radicals to form a treated silicon nitride film.

REFERENCES:
patent: 4158717 (1979-06-01), Nelson
patent: 4857140 (1989-08-01), Lowenstein
patent: 4883686 (1989-11-01), Doehler et al.
patent: 4992299 (1991-02-01), Hochberg et al.
patent: 4992306 (1991-02-01), Hochberg et al.
patent: 5264724 (1993-11-01), Brown et al.
patent: 5273920 (1993-12-01), Kwasnick et al.
patent: 5380566 (1995-01-01), Robertson et al.
patent: 5562952 (1996-10-01), Nakahigashi et al.
patent: 5591494 (1997-01-01), Sato et al.
patent: 5632821 (1997-05-01), Doi
patent: 6001431 (1999-12-01), Itoh et al.
patent: 6017784 (2000-01-01), Ohta et al.
patent: 6087205 (2000-07-01), Yamamori
patent: 6224950 (2001-05-01), Hirata
patent: 6303777 (2001-10-01), Kao et al.
patent: 6324439 (2001-11-01), Cheung et al.
patent: 6348420 (2002-02-01), Raaijmakers et al.
patent: 6413887 (2002-07-01), Fukuda et al.
patent: 6468903 (2002-10-01), Bolscher et al.
patent: 6524955 (2003-02-01), Fukuda et al.
patent: 6544900 (2003-04-01), Raaijmakers et al.
patent: 6555183 (2003-04-01), Wang et al.
patent: 6583046 (2003-06-01), Okada et al.
patent: 6586163 (2003-07-01), Okabe et al.
patent: 6630413 (2003-10-01), Todd
patent: 7091138 (2006-08-01), Numasawa et al.
patent: 2001/0012650 (2001-08-01), Kim et al.
patent: 2003/0148565 (2003-08-01), Yamanaka
patent: 2004/0121085 (2004-06-01), Wang
patent: 2004/0194706 (2004-10-01), Wang
patent: 2005/0020021 (2005-01-01), Fujiwara et al.
patent: 2005/0106896 (2005-05-01), Fukuchi
patent: 2005/0145897 (2005-07-01), Matsuo et al.
patent: 62-051264 (1987-03-01), None
patent: 04-365379 (1992-12-01), None
patent: WO 2004/057653 (2004-07-01), None
patent: WO 2004/059707 (2004-07-01), None
PCT International Search Report for PCT/US03/40793, dated Jun. 30, 2004 (AMAT/7785.PC.02).
Matsumura, et al. “Low-Temperature Chemical-Vapor Deposition of Amorphous Semiconductors and Insulators”, Mat. Res. Soc. Symp. Proc. vol. 297 (1993) pp. 109-120.
Yamaguchi, et al. “The Effect of Hydrogen Plasma on the Properties of a-Si: H/a-Si1-xNx: H Superlattices” Philosophical Magazine Letters, vol. 58, No. 4 (1988) pp. 213-218.
Thomas Reif, Doctoral Dissertation, University of Cologne (2001), no page numbers.
Tanaka, et al. “Film Properties of Low-KNitride Films Formed by Hexachlorodisilane and Ammonia”, J. Electrochemical Soc., vol. 147 (2000) pp. 2284-2289.
Ishihara, et al. “Low Temperature CVD of SiN Using a New Source Gas (Hydrogen Azide)” Journal of Applied Physics, vol. 31 (1992) Part 2 pp. L74-L77.
Ishihara, et al. “Low Temperature CVD of SiN from Tetra-Silane and Hydrogen Azide” Material Research Society Symposium, vol. 284 (1993) pp. 3-8.
Yeh, et al. “Low Temperature CVD of SiN Film from Hexachloro-Disilane and Hydrazine” Journal of Applied Physics, vol. 35 (1996) pp. 1509-1511.
Yoshioka, et al. “Deposition of Silicon Nitride Films by Silane-Hydrazine Process” J. Electrochemical Society, vol. 114 (1967) pp. 962-964.
Laxman, et al. “A Low Temperature Solution for Silicn Nitride Deposition” Solid State Technology, vol. 43 (2000) pp. 79, 80, 82 and 87.
Gordon, et al. “Silicon Dimethylamido Complexes and Ammonia as Precursors for Atmospheric Pressure CVD of SiN Thin Films” Chem. Mater. vol. 2 (1990) pp. 480-482.
Levy, et al. “LPCVD of SiN Using the Environmentally Benigh Precursor Tris(dimethylamino)silane” P. Electrochemical Society, vol. 96-5 (1996) pp. 239-247.
Yacoubi, et al. “Analysis and Modeling of Low Pressure CVD of Silicon Nitride from a Silane-Ammonia Mixture” J. Electrochemical Society, vol. 146 (1999) pp. 3009-3017.
Stuger, et al. “Aminochlorodisilanes as Precursors to Multifunctionalized Disilane Derivative” J. Organometallic Chem. vol. 547 (1997) pp. 227.
Tamao, et al. “Coupling of (Amino)alkylchlorosilanes with Lithium: New Access to Symmetrical Di- and Tetrafunctional Alkyldisilanes” Organomettalics, vol. 12 (1993) pp. 580-582.
Huber, et al. “Hexa(amino)disilanes With Saturated Cyclic Amino Ligands” Chemical Monthly, vol. 130 (1999) pp. 133-138.
Schuh, et al. “Disilany-amines—Compounds Comprising the Structural Unit Si-Si-N, as Single Source Precursors for PECVD of SiN” Zeitschrift for Anorganische and Allgemeine Chemie, vol. 619 (1993) pp. 1347-1352.
Wheeler, et al. “Aminodisilanes as Silylating Agents for Dry-Developed Positive-Tone Resists for Deep Ultraviolet (248nm) and Extreme Ultraviolet (13.5) Microlithography” Proceedings of the SPIE, vol. 2438 (1995) pp. 762-774.
Kitoh, et al. “Formation of SiN Films by PECVD Using [(CH3)2N]3SiN3” Journal of Applied Physics, vol. 33 (1994) pp. 7076-7079.
Smirnova, et al. “SiCN Films as New Materials Obtained by PCVD from Novel Precursor” Proceedings of SPIE, vol. 4467 (2001) pp. 366-376.
Klingebiel, et al. “Cyclization and Isomerization Reactions in Silylhydrazine Chemistry” Chemical Monthly, vol. 32 (2001) pp. 1105.
PCT International Search Report for PCT/US04/014999, dated Jun. 24, 2005 (AMAT/7785.PC.03).

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