Method for forming a high density printed wiring board

Details Method for forming a high density printed wiring board Method for forming a high density printed wiring board

1984-07-31

1986-05-27

Lawrence, Evan K.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156656, 1566611, 156902, H01L 21306, H01L 21312

Patent

active

045914117

ABSTRACT:
Feed-through vias (38) of 8 mil and smaller diameter are placed on 25 mil centers or smaller so that the feed-through vias serve only as electrical connections and do not block channels between conductors (24a and 42a). The method for forming such feed-through vias and interconnections utilizes a metallic resist (36 and 40) which covers the feed-through vias so that the metallic resist, along with conventional photoresist material, prevent undesired etching of the feed-through vias even in the event of misregistration of the photoresist material.

REFERENCES:
patent: 3335489 (1967-08-01), Grant
patent: 3391457 (1968-08-01), Reimann
patent: 3464855 (1969-09-01), Shaheen et al.
Greene, K. F., "Producing Printed Circuit Boards", IBM Technical Disclosure Bulletin, vol. 11, No. 12, May 1969, p. 1676.
Smith, J. F. et al., "Selectively Removing Dielectric Materials", IBM Technical Disclosure Bulletin, vol. 11, No. 9, Feb. 1969, p. 1151.

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