Method for forming a gate in a semiconductor, which prevents...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – Insulated gate formation

Reexamination Certificate

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C438S486000, C438S592000, C438S655000, C438S664000

Reexamination Certificate

active

11156287

ABSTRACT:
A method for forming a gate in a semiconductor device includes the steps of: providing a substrate having active and field regions; selectively etching a portion of the active region to form a trench; forming on the substrate including the trench an amorphous conductive film for forming a gate; subjecting the resulting structure to an annealing process so as to convert the amorphous conductive film into a crystalline conductive film; and selectively etching the crystalline conductive film so as to form a gate covering the corner portion of the trench.

REFERENCES:
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patent: 6284635 (2001-09-01), Jang
patent: 2001/0036728 (2001-11-01), Shinmura
patent: 2005/0173759 (2005-08-01), Kim et al.
patent: 2007/0117294 (2007-05-01), Kim
patent: 2007/0117364 (2007-05-01), Kim
patent: 04-105324 (1992-04-01), None
patent: 07078981 (1995-03-01), None
patent: 2001003341 (2001-01-01), None
patent: 1020040108247 (2004-12-01), None
Wolf et al., Stanley, “Crystalline Defects, Thermal Processing, and Gettering,” Silicon Processing for the VLSI Era—vol. 1: Process Technolgy, Lattice Press (1986), pp. 56-58.

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