Method for forming a film on a substrate by activating a reactiv

Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma

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427572, 427573, 427574, 427578, 427596, B05D 306

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057765570

ABSTRACT:
A thin film forming method which comprises the steps of supporting a substrate to be treated, having a trench or an unevenness thereon, in a reaction vessel; introducing a reactive gas into the reaction vessel; activating the reactive gas to form a deposit species, the deposit species characterized by a phase diagram including a liquid phase region defined by a melting curve and an evaporation curve that intersect at a triple point; and forming a thin film containing at least a part of the deposit species on the substrate while retaining a pressure of the deposit species in the reaction vessel higher than the triple point of the phase diagram of the deposit species, and retaining a temperature of the substrate within the liquid phase region of the phase diagram of the deposit species.

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S. Noguchi et al., "Liquid Phase Oxidation Employing O Atoms Produced by Microwave Discharge and Si (CH.sub.3).sub.4 ", Extended Abstracts of the 19th Conf. on Solid State Devices and Materials, pp. 451-454 (1987).
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