Coating processes – Direct application of electrical – magnetic – wave – or... – Plasma
Patent
1999-03-05
2000-08-29
King, Roy V.
Coating processes
Direct application of electrical, magnetic, wave, or...
Plasma
4272497, 427571, 427572, 427575, 427902, 427904, 427576, 427578, 427122, 4272498, H05H 124, H05H 102
Patent
active
061105422
ABSTRACT:
A method for forming a film by a plasma CVD process in which a high density plasma is generated in the presence of a magnetic field is described, characterized by that the electric power for generating the plasma has a pulsed waveform. The electric power typically is supplied by microwave, and the pulsed wave may be a complex wave having a two-step peak, or may be a complex wave obtained by complexing a pulsed wave with a stationary continuous wave of an electromagnetic wave having the same or different wavelength as that of the pulsed wave. The process enables deposition of a uniform film having an excellent adhesion to the substrate, at a reduced power consumption.
REFERENCES:
patent: 3661637 (1972-05-01), Sirtl
patent: 3911318 (1975-10-01), Spero
patent: 4047496 (1977-09-01), Mc Neilly
patent: 4183780 (1980-01-01), McKenna et al.
patent: 4238708 (1980-12-01), Kaneda
patent: 4349582 (1982-09-01), Beerwald et al.
patent: 4401054 (1983-08-01), Matsuo et al.
patent: 4438368 (1984-03-01), Abe
patent: 4481229 (1984-11-01), Suzuki
patent: 4503807 (1985-03-01), Nakayama
patent: 4513684 (1985-04-01), Nath et al.
patent: 4532199 (1985-07-01), Ueno
patent: 4559100 (1985-12-01), Ninomiya
patent: 4563240 (1986-01-01), Shibata
patent: 4569738 (1986-02-01), Kieser et al.
patent: 4636401 (1987-01-01), Yamazaki et al.
patent: 4640224 (1987-02-01), Bunch
patent: 4657776 (1987-04-01), Dietrich et al.
patent: 4663183 (1987-05-01), Ovshinsky et al.
patent: 4684535 (1987-08-01), Heinecke et al.
patent: 4727293 (1988-02-01), Asmussen et al.
patent: 4764394 (1988-08-01), Conrad
patent: 4776918 (1988-10-01), Otsubo
patent: 4816113 (1989-03-01), Yamazaki
patent: 4824690 (1989-04-01), Heinecke et al.
patent: 4869923 (1989-09-01), Yamazaki
patent: 4876983 (1989-10-01), Fukuda et al.
patent: 4891118 (1990-01-01), Ooiwa et al.
patent: 4910041 (1990-03-01), Yanagihara et al.
patent: 4910043 (1990-03-01), Freeman et al.
patent: 4933300 (1990-06-01), Koinuma et al.
patent: 4935303 (1990-06-01), Ikoma et al.
patent: 4935661 (1990-06-01), Heinecke et al.
patent: 4973494 (1990-11-01), Yamazaki
patent: 5015493 (1991-05-01), Gruen
patent: 5015494 (1991-05-01), Yamazaki et al.
patent: 5039548 (1991-08-01), Hirose et al.
patent: 5085750 (1992-02-01), Soraoka et al.
patent: 5093151 (1992-03-01), Van Den Gerg et al.
patent: 5126163 (1992-06-01), Chan
patent: 5138520 (1992-08-01), McMillan et al.
patent: 5160397 (1992-11-01), Doki et al.
patent: 5162296 (1992-11-01), Yamazaki
patent: 5182132 (1993-01-01), Murai et al.
patent: 5230931 (1993-07-01), Yamazaki et al.
patent: 5231057 (1993-07-01), Doki et al.
patent: 5252178 (1993-10-01), Moslehi
patent: 5266363 (1993-11-01), Yamazaki
patent: 5289010 (1994-02-01), Shohet
patent: 5296272 (1994-03-01), Matossian et al.
patent: 5330800 (1994-07-01), Schumacher et al.
patent: 5354381 (1994-10-01), Sheng
patent: 5427827 (1995-06-01), Shing et al.
patent: 5626922 (1997-05-01), Miyanaga et al.
Hiroshi Kawarada et al., "Large Area Chemical Vapour Deposition of Diamond Particles and Films Using Magneto-Microwave Plasma", Japanese Journal of Applied Physics, vol. 26, No. 6, Jun., 1987, pp. L1032-L1034.
McGraw-Hill Encyclopedia of Science and Technology, vol. 6, pp. 387-388, .COPYRGT.1960, New York.
Inoue Tohru
Miyanaga Akiharu
Yamazaki Shunpei
King Roy V.
Robinson Eric J.
Semiconductor Energy Laboratory Co,. Ltd.
LandOfFree
Method for forming a film does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method for forming a film, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a film will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1247324