Method for forming a device isolation film of a semiconductor de

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437 70, 437968, H01L 2176

Patent

active

055232558

ABSTRACT:
A method for forming a device isolation film of a semiconductor device, which includes the steps of forming a pad oxide film on a semiconductor substrate, forming an oxidation buffer layer on the pad oxide film, forming an oxidation prevention film on the oxidation buffer layer, forming an aperture in the oxidation prevention film and a longitudinally co-extensive recess in the oxidation buffer layer, to thereby expose a portion of the oxidation buffer layer, forming a cap oxide film on the exposed portion of the oxidation buffer layer by subjecting a first resultant structure obtained by the preceding steps to a thermal oxidation process, forming an oxynitride film at an interface between the cap oxide film and the oxidation buffer layer by heat-treating a second resultant structure obtained by the preceding steps in a nitrogen atmosphere, and, forming the device isolation film by subjecting a third resultant structure obtained by the preceding steps to a thermal oxidation process.

REFERENCES:
patent: 5260229 (1993-11-01), Hodges et al.
patent: 5358893 (1994-10-01), Yang et al.
patent: 5447885 (1995-09-01), Cho et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method for forming a device isolation film of a semiconductor de does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for forming a device isolation film of a semiconductor de, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for forming a device isolation film of a semiconductor de will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-383067

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.