Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Patent
1997-12-17
1999-10-05
Niebling, John F.
Semiconductor device manufacturing: process
Coating with electrically or thermally conductive material
To form ohmic contact to semiconductive material
438685, 438905, H01L 2144
Patent
active
059638346
ABSTRACT:
A method for forming a CVD film, comprising the steps of loading at least one object to be processed into a processing chamber and positioning the object on a support base in the processing chamber, after positioning the object in the processing chamber, introducing a process gas from a corresponding gas supply source via a corresponding gas introducing pipe into the processing chamber and forming a film by a chemical vapor deposition method on the object in the processing chamber, after forming the film on the object, unloading the object from the processing chamber, after unloading the object from the processing chamber, dry-cleaning an inside of the processing chamber, and after dry-cleaning the inside of the processing chamber, introducing an inert gas via a corresponding gas introducing pipe into the chamber to purge those particles deposited as a residue in the gas introducing pipe and inside of the chamber.
REFERENCES:
patent: 5326723 (1994-07-01), Petro et al.
patent: 5709757 (1998-01-01), Hatano et al.
patent: 5785796 (1998-07-01), Lee
Akiba Keishi
Hatano Tatsuo
Murakami Seishi
Shimizu Takaya
Jones Josetta
Niebling John F.
Tokyo Electron Limited
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