Method for forming a conductive layer

Details Method for forming a conductive layer Method for forming a conductive layer

2005-08-02

2005-08-02

Zarneke, David (Department: 2829)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S701000, C438S700000, C438S689000, C438S948000, C438S952000, C430S299000, C430S315000, C430S015000, C430S317000

Reexamination Certificate

active

06924230

ABSTRACT:
A method for forming a conductive layer is disclosed, which has the following steps. First, a substrate is provided, and then a patterned photoresist layer having an undercut is formed on the substrate. After that, at least one conductive layer is deposited on the substrate. Finally, the patterned photoresist layer is lifted off; wherein the shape of the conductive layer remaining on the substrate is complementary to that of the patterned photoresist layer.

REFERENCES:
patent: 4824767 (1989-04-01), Chambers et al.
patent: 4871651 (1989-10-01), McCune et al.
patent: 5017459 (1991-05-01), McColgin
patent: 5324671 (1994-06-01), Bayraktaroglu
patent: 5766808 (1998-06-01), Linde et al.
patent: 6444484 (2002-09-01), Ahn
patent: 6489227 (2002-12-01), Hsieh et al.

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