Method for forming a ceramic circuit board

Details Method for forming a ceramic circuit board Method for forming a ceramic circuit board

1993-01-04

1994-10-11

Dang, Thi

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

156634, 156656, 156664, C23F 100

Patent

active

053544153

ABSTRACT:
Method for forming a ceramic circuit board by forming a metal circuit pattern on a ceramic board through an active metal ingredient-containing brazing material and removing an unnecessary part of the brazing material by chemical liquor treatment.

REFERENCES:
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patent: 4647477 (1987-03-01), DeLuca
patent: 4712161 (1987-12-01), Pryor et al.
patent: 5019187 (1991-05-01), Iyogi et al.
patent: 5025116 (1991-06-01), Kawakami et al.
patent: 5036167 (1991-07-01), Kasai
patent: 5058799 (1991-10-01), Zsamboky
patent: 5110384 (1992-05-01), Dudek et al.
patent: 5240551 (1993-08-01), Matsumura et al.
Patent Abstracts of Japan, vol. 13, No. 551 (E-857)(3899), Dec. 8, 1989, JP-A-12 30 290, Sep. 13, 1989.

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