Plastic and nonmetallic article shaping or treating: processes – Treatment of material by vibrating – jarring – or agitating...
Reexamination Certificate
1999-07-28
2001-07-17
Ortiz, Angela (Department: 1732)
Plastic and nonmetallic article shaping or treating: processes
Treatment of material by vibrating, jarring, or agitating...
C264S261000, C264S272170, C156S293000, C156S295000
Reexamination Certificate
active
06261492
ABSTRACT:
FIELD OF THE INVENTION
This invention relates in general to electronic engineering and more specifically to a method for fitting the semiconductor chip.
BACKGROUND OF THE INVENTION
A method of fitting a semiconductor chip on the surface of an integrated circuit board or on the package bottom is known (cf “Assembly techniques of integrated circuits” by V. A. Dubolazov et al., “Vischa shkola” PH, Kiev, 1987, pp.60-62 (in Russian)), said method comprising a gripping of the chip with a tool which appears as a bar having a porthole for vacuum admission, and a recess in the end face, shaped as a frustum of pyramid, said recess being large enough for the chip to sink half its size into the recess. Then the board and the tool are heated, the chip is transferred to the bonding site and pressed against the mounting surface, whereupon vibration is applied thereto. Once the chip is attached with a binder (solder or adhesive) the source of vacuum is cut off and the tool is withdrawn.
However, the method discussed above fails to provide fitting of chips into the board volume (either into the recess in the board surface or in to the hole therein) so as the surface of the chip is coincided with that of the board. This results in a low reproducibility of the length of leads and reduces the chip bonding accuracy.
One more prior-art fitting method is known (GB, B, 2,138,205), wherein the manufacturing process of a microwave circuit consists in that the semiconductor chip is pressed into the tool which is in fact a bar having a flat end and a capillary in the central portion, said capillary so flaring out towards the end tool portion that the edges of the tool end portion overlap the peripheral chip portion and extend beyond the limits thereof, thus locally deforming the substrate. As a result, a hollow is formed having the shape and depth corresponding to those of the chip which is held in the substrate by virtue of its thrusting against the faces of the hollow. Reduced deformation of the lower substrate surface is attained due to use of the initial recess.
However, with the aforesaid method for chip fitting the substrate is deformed and its flatness is upset. Moreover, the method suffers from low manufacturability.
When pressing the chip into such a substrate it is hard to determine the instant when the pressing is terminated, which might inflict a distortion upon the substrate when the surface of the chip is coinceded with that of the circuit board. The distortion of the substrate reverse side disturbs its flatness, which hampers substrate mounting on a heat sink base.
SUMMARY OF THE INVENTION
The present invention has for its principal object to provide a method for fitting the semiconductor chip, wherein the chip is so pressed into the recess in the mounting surface as to attain higher manufacturability of the process and accuracy of the chip fitting due to a prevention of a substrate distortion.
The foregoing object is accomplished due to the fact in a method for fitting the semiconductor chip, wherein a recess is made in the mounting surface, the chip is gripped from its face side with a gripping tool having a flat end and a capillary hole in its central portion, said hole flaring up towards the tool end, the chip is oriented above said recess and pressed thereinto until the chip face surface is coincided with the mounting surface, whereupon the gripping tool is released, according to the invention, the recess has the dimensions exceeding those of the chip, the pressing of the latter into the recess is preceded by placing a specified amount of a binder in said recess, the chip is pressed into said binder until that portion of the tool flat end which extends beyond the chip outlines thrusts against the mounting surface so that the space confined between the chip and the surface of the recess gets partially or completely filled with the binder.
Used as the mounting surface may be the surface of the integrated circuit board substrate, or the surface of the package, or that of the base of the hybrid integrated circuit.
The gripping tool is not released until the binder solidifies.
The recess may be at least partially metal-coated, and an electrically conducting material may be used as the binder.
Vibrations may be applied to the gripping tool and/or to the surface wherein the recess is made, at the instant of chip pressing-in.
The chip may be gripped by a vacuum suction cup, and an excess pressure of 0.1 to 300 mm Hg is applied to the capillary hole in the tool in the lapse of time between releasing the chip from the tool and disconnection of the source of vacuum.
The chip pressing-in procedure may be ceased by causing part of the tool to thrust against the surface in which the recess is made. The tool extends beyond the limits of the recess by 1 to 500 &mgr;m, and the length and width of the recess exceed the chip dimensions by 0.01 to 1.0 mm, and the depth thereof exceeds the chip thickness by 0.001 to 0.5 mm.
The chip pressing-in procedure may be ceased by causing a part of the tool to thrust against the surface in which the recess is made and which is free from the topological metallization pattern, or by causing a part of the tool gripping member rigidly coupled to the tool to do so.
Placing a specified amount of the binder in the recess prior to chip pressing-in provides for catching the chip by the binder without distorting the substrate, and ceasing the chip pressing-in procedure at the instant when the chip face surface is coincided with the surface in which the recess is made, ensures that the leads for welding can be as short as possible.
The minimum amount of the binder is selected so as to provide strong holding of the chip in place, while the maximum amount thereof is selected so as to prevent the chip against getting out of the recess, which might result in shorting the leads when the binder is electrically conducting, or in soiling the chip surface when the binder is nonconducting, which might impede welding the leads to the contact pads.
Providing the metallization in the recess and making use of an electrically conducting binder enables one to hold the chip reliably using a solder and also facilitates grounding of the chip.
Applying vibration to the chip and/or to a component, wherein the recess is made, at the instant of the chip pressing-in makes it possible to improve the quality of the soldered joint.
Gripping the chip with the vacuum suction cup makes it possible to prevent the chip from displacement during tool disconnection by applying an excess pressure into the tool channel, the lower limit value of the pressure applied into the tool being determined by the minimum pressure applied thereto in order to balance the force by which the chip is attracted to the tool, while the upper limit value of pressure is selected such that an air or gas stream would not displace the chip pressed into the recess.
Solidificating the binder before disconnecting the tool from the chip promotes to hold the latter and reduces the probability of its displacement during tool disengagement.
Ceasing the chip pressing-in procedure by making the tool to thrust against the board surface at the edges of the recess enables one to attain the desired effect by virtue of a predetermined ratio between the dimensions of the recess, the chip, and the tool, without any additional forces, and to automate the technological process.
The necessary conditions for cessating the pressing-in procedure are provided, on the one hand, by a minimum amount of tool engagement with the chip and, on the other hand, by the necessity to save the material the tool is made from. An excess of the recess dimensions over those of the chip makes possible such an arrangement of the chip in the recess that the plane of the chip face surface is coincide with that of the board surface.
The dimensions of the recess for the chip are limited from below by a possibility to fit the chip, and from above they are limited by deteriorating the dimensional characteristics.
Ceasing the pressing-in procedure at the instant when the tool thrust
Kenaga Michael L.
Ortiz Angela
Piper Marbury Rudnick & Wolfe
Samsung Electronics Co,. Ltd.
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