Method for fault analysis in wafer production

Details Method for fault analysis in wafer production Method for fault analysis in wafer production

2005-01-25

2005-01-25

Paladini, Albert W. (Department: 2125)

Data processing: generic control systems or specific application

Specific application, apparatus or process

Product assembly or manufacturing

C700S121000, C702S084000

Reexamination Certificate

active

06847855

ABSTRACT:
With the aid of the method for fault analysis according to the invention, a wide variety of chips are mapped by means of a transformation onto at least one uniform comparable wafer map. This transformation or resealing enables a chip-area-independent assessment of the products or the fabrication processes. The method for fault analysis according to the invention furthermore has the advantage that the information thus obtained can be stored very compactly in corresponding wafer databases and is thus available for further evaluations.

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Lee et al, “Design of Intelligent Data Sampling Methodology Based on Data Mining”,IEEE Transactions on Robotics and Automation, vol. 17, No. 5, Oct. 2001, pp. 637-649.
Langfold et al, “The Application and Validation of a New Robust Windowing Method for the Poisson Yield Model”,2001 IEEE/SEMI Advanced Semiconductor Manufacturing Conference, Apr. 2001, pp. 157-160.

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