Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1986-11-14
1987-10-27
Powell, William A.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156648, 156657, 357 236, 357 72, 357 80, 437 43, 437 52, H01L 2104, H01L 2122, H01L 21306, B44C 122
Patent
active
047027967
ABSTRACT:
The present invention is a method for fabricating a semiconductor device, wherein impurity is selectively diffused to surround a region (7) of a second conductivity type as a bit line formed on a semiconductor substrate (1), thereby forming an impurity diffused region (9) of a first conductivity type having high density and, by extending the impurity diffused region (9) in the element separating step to form a high density region of the first conductivity type having high density.
REFERENCES:
patent: 4335502 (1982-06-01), Richman
patent: 4536947 (1985-08-01), Bohr et al.
"Double Polysilicon Dynamic Random-Access Memory Cell with Increased Charge Storage Capacitance", V. L. Rideout, IBM Technical Disclosure Bulletin, vol. 21, No. 9, Feb. 1979, pp. 3823-3825.
Kawai Akira
Nagatomo Masao
Nakajima Masayuki
Ozaki Hiroji
Sato Shin'ichi
Mitsubishi Denki & Kabushiki Kaisha
Powell William A.
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