Method for fabrication of semiconductor device

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – On insulating substrate or layer

Reexamination Certificate

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Details

C438S151000, C438S156000, C438S300000

Reexamination Certificate

active

07772053

ABSTRACT:
After forming a source-drain material film on an insulator layer, an opening portion reaching the insulator layer is formed in the source-drain material film. Then, a channel having desired thickness and a gate insulator are sequentially formed on the insulator layer and the source-drain material film in the opening portion. Thereafter, a gate material film embedding the opening portion is formed on the gate insulator. Subsequently, a cap film is formed on the gate material film, thereby forming the gate made of the gate material film. Then, a mask layer is formed on the source-drain material film. Next, the source-drain material film not protected by the mask layer is removed while protecting the gate by the cap film, thereby leaving the source-drain material film on both sides of the gate. The source-drain material film on one side becomes the source and that on the other side becomes the drain.

REFERENCES:
patent: 5393681 (1995-02-01), Witek et al.
patent: 5648276 (1997-07-01), Hara et al.
patent: 6162688 (2000-12-01), Gardner et al.
patent: 6204100 (2001-03-01), Kim
patent: 6214680 (2001-04-01), Quek et al.
patent: 6346447 (2002-02-01), Rodder
patent: 05-190856 (1993-07-01), None
patent: 06-021458 (1994-01-01), None

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