Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive
Patent
1994-03-07
1997-08-26
Powell, William
Semiconductor device manufacturing: process
Making device or circuit responsive to nonelectrical signal
Physical stress responsive
216 2, 216 67, 438456, 438739, H01L 2100
Patent
active
056606800
ABSTRACT:
This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures.
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Egan, III William J.
Powell William
The Regents of the University of California
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