Method for fabrication of a contact structure

Details Method for fabrication of a contact structure Method for fabrication of a contact structure

2007-02-13

2007-02-13

Malsawma, Lex H. (Department: 2823)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

Reexamination Certificate

active

10755844

ABSTRACT:
A method for producing a contact structure on a structured surface comprising producing a first conductive layer on the structured surface, wherein the first conductive layer comprising tungsten. A conductive seed layer is produced on the first conductive layer, the contact structure being produced by electroplating on the seed layer. The first conductive layer serves as an etch stop for selectively removing substrate material from the backside.

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Burkett et al., “Processing Techniques for 3-D Integration Techniques”, Superficies y Vacio 13, 1-6, Dec. 2001. (6 pages).

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