Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Encapsulating
Reexamination Certificate
2006-10-17
2006-10-17
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Encapsulating
C257SE21502
Reexamination Certificate
active
07122407
ABSTRACT:
A method for fabricating a window ball grid array (WBGA) semiconductor package is provided. A substrate is prepared having a through opening and ball pads on a lower surface thereof. A chip is mounted over the opening of the substrate via an adhesive, with gaps not applied with the adhesive left between the chip and substrate. The chip is electrically connected to the substrate via bonding wires through the opening. A spacer is attached to the lower surface of the substrate and has a through hole and a recessed portion around the through hole. During molding, the spacer is clamped between the substrate and a mold, and the recessed portion is located between the ball pads and the opening, such that a resin material for forming an encapsulation body encapsulates the chip and flows through the gaps to encapsulate the bonding wires. The recessed portion holds resin flash therein.
REFERENCES:
patent: 2005/0062152 (2005-03-01), Tsai
patent: 2005/0062155 (2005-03-01), Tsai
Horng Chih-Horng
Kim Sung-Jin
Tsai Ming-Sung
Yang Chung-Ta
Clark & Brody
Coleman W. David
Nixon William F.
Ultra Tera Corporation
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