Method for fabricating ultra-high tensile-stressed film and...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S066000, C257S288000, C257S327000, C257SE23132, C257SE29242, C257SE29255

Reexamination Certificate

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07655987

ABSTRACT:
A metal-oxide-semiconductor (MOS) transistor device is disclosed. The MOS transistor device comprises a semiconductor substrate; a gate structure on the semiconductor substrate; source/drain regions on the semiconductor substrate adjacent to the gate structure; an ultra-high tensile-stressed nitride film having a hydrogen concentration of less than 1E22 atoms/cm3covering the gate structure and the source/drain regions; and an inter-layer dielectric (ILD) film over the ultra-high tensile-stressed nitride film.

REFERENCES:
patent: 6277720 (2001-08-01), Doshi
patent: 6372672 (2002-04-01), Kim
patent: 2005/0245012 (2005-11-01), Bu et al.
patent: 2006/0105106 (2006-05-01), Balseanu
patent: 2007/0066022 (2007-03-01), Chen
Massive stress changes in plasma-enhanced chemical vapor deposited silicon nitride films on thermal cycling, Michael P. Hughey, Robert F. Cook, Thin Solid Films 460 (2004) 7-16.
Ven, Advantages of Dual Frequency PECVD for Deposition of ILD and Passivation Films, IEEE, 1990, 194-201.

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