Method for fabricating thin film transistor device

Semiconductor device manufacturing: process – Formation of semiconductive active region on any substrate – Amorphous semiconductor

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438585, 438593, H01L 2120

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active

059435933

ABSTRACT:
A method for crystallizing a portion of a semiconductor thin film while forming a semiconductor device comprises providing a transparent substrate supporting a metallic gate electrode and an amorphous semiconductor thin film which are separated from each other by a gate insulating film, heating the gate electrode by subjecting it to light rays, and applying a laser beam to the amorphous semiconductor thin film so that the portion of the semiconductor thin film adjacent the metallic gate electrode is heated by both the laser beam and the heat of the gate electrode to cause a crystallization of a portion of the amorphous thin film and then processing the remaining amorphous portions of the thin film to form the transistor structure.

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Nishimura et al, "Evaluation and Control of Grain Boundaries in Laser-Recrystallized Polysilicon Islands for Device Fabrication", Japanese Journal of Applied Physics, vol. 22 (1983) Supplement 22-1, pp. 217-221. Month Unknown.
Noguchi et al, "Enlargement of P-Si Film Grain Size by Excimer Laser Annealing and Its Application to High-Performance P-Si TFT", Extended Abstracts of the 1991 International Conference on Solid State Devices and Materials, Yokohama, 1991, pp. 623-625. Month Unknown.

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