Method for fabricating semiconductor package with heat sink

Details Method for fabricating semiconductor package with heat sink Method for fabricating semiconductor package with heat sink

2008-05-13

2008-05-13

Tran, Long K. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S126000, C438S127000, C257S796000, C257S787000, C257SE21050, C257SE21080

Reexamination Certificate

active

11580736

ABSTRACT:
A semiconductor package with a heat sink and a method for fabricating the same are proposed. The heat sink is provided with a rigid and thermally resistant detach member on a top surface thereof, and is attached via its bottom surface to a chip mounted on a chip carrier. The detach member is sized larger than the heat sink and can be easily removed from the top surface of the heat sink. Subsequently, a molding process is performed to form an encapsulant for completely encapsulating the chip, the heat sink and the detach member. Then, a singulation process is performed to cut along predetermined cutting lines located between sides of the heat sink and corresponding sides of the detach member. Finally, the detach member and a portion of the encapsulant formed on the detach member are removed from the heat sink. The above fabrication method reduces the packaging cost.

REFERENCES:
patent: 5216278 (1993-06-01), Lin et al.
patent: 5477626 (1995-12-01), Kwon
patent: 5736785 (1998-04-01), Chiang et al.
patent: 6069027 (2000-05-01), Mertol et al.
patent: 6429512 (2002-08-01), Huang et al.
patent: 6433420 (2002-08-01), Yang et al.
patent: 6444498 (2002-09-01), Huang et al.
patent: 6458626 (2002-10-01), Huang et al.
patent: 6462405 (2002-10-01), Lai et al.
patent: 6506681 (2003-01-01), Grigg et al.
patent: 6522428 (2003-02-01), Chiu et al.
patent: 6528876 (2003-03-01), Huang
patent: 2004/0212080 (2004-10-01), Chen et al.

Affiliated with

Also associated with

Rating

Method for fabricating semiconductor package with heat sink does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method for fabricating semiconductor package with heat sink, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method for fabricating semiconductor package with heat sink will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3922944