Method for fabricating semiconductor micro epi-optical component

Details Method for fabricating semiconductor micro epi-optical component Method for fabricating semiconductor micro epi-optical component

1998-08-18

2000-06-13

Bowers, Charles

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Mesa formation

438800, 438 29, 438 48, H01L 2100

Patent

active

060748885

ABSTRACT:
A method for fabricating a monolithic micro-optical component. The construction of the micro-optical components is accomplished by using standard semiconductor fabrication techniques. The method comprises the steps of depositing an etch stop layer (44) onto a semiconductor substrate (42); depositing an optical component layer (46) onto the etch stop layer (44); coating the entire surface of the optical component layer with a photoresist material; applying a photoresist mask (50) to the photoresist material on the optical component layer (46); selectively etching away the optical component layer (46) to form at least one optical column (52); forming a pedestal (54) for each of the optical columns (52) by selectively etching away the etch stop layer (44); and finally polishing each of the optical columns (52), thereby forming monolithic optical components (56). The method may optionally include the step of removing the photoresist mask from each of the optical columns prior to polishing the optical columns, as well as the step of depositing an antireflectivity coating onto each of the optical components.

REFERENCES:
patent: 4376160 (1983-03-01), Evanchuk
patent: 5037199 (1991-08-01), Hlousek
patent: 5498444 (1996-03-01), Hayes
patent: 5514888 (1996-05-01), Sano et al.
patent: 5707684 (1998-01-01), Hayes et al.
patent: 5734490 (1998-03-01), Rabarot et al.

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