Semiconductor device manufacturing: process – With measuring or testing – Electrical characteristic sensed
Patent
1997-12-03
2000-02-08
Dutton, Brian
Semiconductor device manufacturing: process
With measuring or testing
Electrical characteristic sensed
324755, G01R 3126, H01L 2166
Patent
active
060227508
ABSTRACT:
An interconnect for a semiconductor die includes integrally formed test structures for evaluating various electrical characteristics of the interconnect. The test structures can include Kelvin structures, van der Pauw structures, resistors, capacitors, contact chains, via chains, serpentine test structures, and antenna test structures. Among the electrical characteristics that can be evaluated are the resistivity of contact member, conductor and substrate components of the interconnect, contact resistance between the contact members and conductors and capacitance of the contact members and conductors with respect to the substrate.
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Akram Salman
Hembree David R.
Dutton Brian
Gratton Stephen A.
Micro)n Technology, Inc.
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